| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| PEX8747-CA80FBCG | PLX |
BGA |
15+ |
31 |
||||
| INA240A1EDRQ1 | TI/德州仪器 |
SOP-8 |
22+ |
34 |
||||
| PIC18F66J11-I/PT | MICROCHIP/微芯 |
QFP |
18+ |
35 |
||||
| XC3S50A-4TQG144C | XILINX/赛灵思 |
TQFP144 |
0925+ |
45 |
||||
| PIC18LF6722-I/PT | MICROCHIP/微芯 |
QFP64 |
15+ |
45 |
||||
| MAX9737ETG+T | MAXIM/美信 |
TQFN24 |
22+ |
47 |
||||
| MSP430F5438AIPZ | TI/德州仪器 |
LQFP100 |
17+ |
52 |
||||
| MPU-6500 | INVENSENSE/应美盛 |
QFN |
15+ |
57 |
||||
| LTM4601EV#PBF | LTC |
LGA118 |
13+ |
59 |
||||
| K4T1G164QG-BCE7 | SAMSUNG/三星 |
BGA |
14+15+ |
63 |
||||
| LT6700MPS6-1#TRMPBF | ADI/亚德诺 |
TSOT23-6 |
22+ |
93 |
||||
| S29GL128P90TFIR10 | SPANSION/飞索半导体 |
TSOP56 |
12+ |
98 |
||||
| TESEO-LIV3R | ST/意法 |
LCC-18 |
19+ |
110 |
||||
| EPM3256ATC144-10N | ALTERA/阿尔特拉 |
QFP144 |
08+06+ |
122 |
||||
| MAX491ESD+ | MAXIM/美信 |
SOP14 |
08+ |
134 |
||||
| MT41K256M8DA-125:K | MICRON/美光 |
BGA |
1730+ |
148 |
||||
| LTM8025EY#PBF | LINEAR/凌特 |
BGA35 |
16+ |
149 |
||||
| MSP430F5438IPZR | TI/德州仪器 |
LQFP100 |
17+ |
167 |
||||
| MC33GD3100EK | NXP/恩智浦 |
SSOP32 |
22+ |
168 |
||||
| LT5534ESC6#TRPBF | LT |
SC70-6 |
14+ |
169 |
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